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Rogers RT/duroid 6002 DK2.94 Df0.0012 (0.005-0.060") PTFE Ceramic Laminate
Brief Introduction
RT/duroid 6002 is a PTFE/ceramic laminate designed for high-frequency circuit applications requiring consistent electrical performance across a wide temperature range. It offers a dielectric constant of 2.94 ±0.04 (for thicknesses ≥0.020") and an ultra-low dissipation factor of 0.0012 at 10 GHz. The material features excellent thermal stability with a thermal coefficient of dielectric constant of +5 ppm/°C, making it ideal for applications requiring stable phase and amplitude performance across temperature variations.
Technical Features & Benefits
- Dielectric Constant: 2.94 ±0.04 (for thicknesses ≥0.020")
- Note: 0.005" laminates: 3.06 ±0.04
- Note: 0.010" and 0.015" laminates: 3.02 ±0.04
- Ultra-low dissipation factor: 0.0012 @ 10 GHz
- Excellent thermal stability: TCDk +5 ppm/°C (-50°C to +150°C)
- Low Z-axis CTE: 30 ppm/°C for superior plated through hole reliability
- Very low moisture absorption: 0.04%
- High thermal conductivity: 0.68 W/m/K
- UL 94 V-0 flammability rating
- Lead-free process compatible
- Excellent dimensional stability
- High copper peel strength
Typical Properties: Rogers RT/duroid 6002
| Property |
Typical Value |
Direction |
Units |
Conditions |
Test Method |
| Electrical Properties |
|
|
|
|
|
| Dielectric Constant εr |
2.94 ± 0.04 [3] |
Z |
- |
10 GHz/23°C |
IPC-TM-650, 2.5.5.5 |
| Dissipation Factor, Tan δ |
0.0012 |
Z |
- |
10 GHz/23°C |
IPC-TM-650, 2.5.5.5 |
| Thermal Coefficient of εr |
+5 |
Z |
ppm/°C |
10 GHz, -50 to +150°C |
IPC-TM-650, 2.5.5.5 |
| Volume Resistivity |
10⁶ |
Z |
MΩ·cm |
A |
ASTM D257 |
| Surface Resistivity |
10⁹ |
|
MΩ |
A |
ASTM D257 |
| Mechanical Properties |
|
|
|
|
|
| Tensile Modulus |
1007 (146) |
X, Y |
MPa (kpsi) |
23°C |
ASTM D638 |
| Ultimate Stress |
30 (4.3) |
X, Y |
MPa (kpsi) |
23°C |
ASTM D638 |
| Ultimate Strain |
4.9 |
X, Y |
% |
23°C |
ASTM D638 |
| Compressive Modulus |
1035 (150) |
Z |
MPa (kpsi) |
|
ASTM D638 |
| Copper Peel Strength |
9.1 (1.6) |
|
lbs/in (N/mm) |
|
IPC-TM-650 2.4.8 |
| Dimensional Stability |
0.07 |
X, Y |
mm/m (mil/inch) |
after etch + E2/150°C |
IPC-TM-650, 2.4.39 |
| Thermal Properties |
|
|
|
|
|
| Coefficient of Thermal Expansion |
15 |
X |
ppm/°C |
-55 to 288°C |
IPC-TM-650 2.4.41 |
|
15 |
Y |
ppm/°C |
-55 to 288°C |
|
|
30 |
Z |
ppm/°C |
-55 to 288°C |
|
| Thermal Conductivity |
0.68 |
|
W/m/K |
80°C |
ASTM C518 |
| Td |
500 |
|
°C |
|
ASTM D3850 |
| Physical Properties |
|
|
|
|
|
| Moisture Absorption |
0.04 |
|
% |
D23/24, D48/50 |
IPC-TM-650, 2.6.2.1 / ASTM D570 |
| Density |
2.1 |
|
g/cm³ |
|
ASTM D792 |
| Specific Heat |
0.93 (0.22) |
|
J/g/K (BTU/lb/°F) |
|
Calculated |
| Flammability |
V-0 |
|
|
|
UL 94 |
| Lead-Free Process Compatible |
YES |
NOTES:
[1] SI units given first, with other frequently used units in parentheses
[2] References: internal TRs 3824, 5016, 5017, 5035. Tests were at 23°C unless otherwise noted.
[3] Due to construction limitations:
- 0.005" laminates: Dk = 3.06 ± 0.04
- 0.010" and 0.015" laminates: Dk = 3.02 ± 0.04
- ≥0.020" laminates: Dk = 2.94 ± 0.04
Application Areas
- Microwave circuits and components
- Aerospace and defense systems
- Satellite communications
- Phased array antennas
- High-reliability RF components
- Military electronics
- Base station infrastructure
- Automotive radar systems
- Power amplifiers
- Filters and couplers
Available Configurations
- Standard Thicknesses:
- 0.005" (0.127 mm) +/- 0.0005"
- 0.020" (0.508 mm) +/- 0.0010"
- 0.030" (0.762 mm) +/- 0.0010"
- *Additional non-standard thicknesses available from 0.005" to 0.060" in varying increments*
- Standard Panel Sizes:
- 12" x 18" (305 mm x 457 mm)
- 24" x 18" (610 mm x 457 mm)
- Additional panel sizes available upon request
- Standard Claddings:
- Electrodeposited Copper Foil:
- ½ oz (18µm) HH/HH
- 1 oz (35µm) H1/H1
- Rolled Copper Foil:
- ½ oz (18µm) 5R/5R
- 1 oz (35µm) 1R/1R
- Additional claddings and cladding weights, such as resistive foil and reverse treated ED, are available
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